Browse by Subject failure analysis
Showing results 1 to 5 of 5
| Effect of atmospheric pressure plasma treatment for repair of polymer matrix composite for aerospace applications Kumar, Sarath; Abhishek, G; Ullattil, Akhil; Elangundran, TVA; Bhowmik, Shantanu; Devadathan, Saji; Kim, Chun-Gon; et al, JOURNAL OF COMPOSITE MATERIALS, v.50, no.11, pp.1497 - 1507, 2016-05 |
| Effect of conductive particle properties on the reliability of anisotropic conductive film for chip-on-glass applications Yim, MJ; Chung, CK; Paik, Kyung-Wook, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.30, pp.306 - 312, 2007-10 |
| Localization of Short and Open Defects in Multilayer Through Silicon Vias (TSV) Daisy-Chain Structures Piersanti, Stefano; de Paulis, Francesco; Olivieri, Carlo; Jung, Daniel Hyunsuk; Kim, Joungho; Orlandi, Antonio, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.59, no.5, pp.1558 - 1564, 2017-10 |
| The microstructure, thermal fatigue, and failure analysis of near-ternary eutectic Sn-Ag-Cu solder joints Kang S.K.; Lauro P.; Shin D.-Y.; Henderson D.W.; Bartelo J.; Gosselin T.; Cain S.R.; et al, MATERIALS TRANSACTIONS, v.45, no.3, pp.695 - 702, 2004 |
| Thermofluorescent Conjugated Polymer Sensors for Nano- and Microscale Temperature Monitoring Yarimaga, Oktay; Lee, Su-Mi; Ham, Dae-Young; Choi, Ji-Min; Kwon, Soon-Gyu; Im, Mae-Soon; Kim, Sung-Ho; et al, MACROMOLECULAR CHEMISTRY AND PHYSICS, v.212, no.12, pp.1211 - 1220, 2011-06 |
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