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Showing results 1 to 8 of 8

1
Analysis of noise coupling from a power distribution network to signal traces in high-speed multilayer printed circuit boards

Kim, Joungho; Rotaru, MD; Baek, S; Park, J; Yer, MK, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.48, pp.319 - 330, 2006-05

2
Coupling between circular apertures in conducting planes = 도체 평판 위의 원형 개구면 사이의 결합 해석link

Park, Yong-Bae; 박용배; et al, 한국과학기술원, 2003

3
Coupling Mechanism of Two Dipoles Within a Conductor-Backed Thin Dielectric Slab Above the Earth

D.K.Park; Ra, Jung Woong, IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION, v.46, no.10, pp.1586 - 1586, 1998-10

4
Electromagnetic penetration into 2-D multiple slotted rectangular cavity: TW-wave

Park, HH; Eom, Hyo Joon, IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION, v.48, no.2, pp.331 - 333, 2000-02

5
High-frequency on-chip inductance model

Sim, SP; Lee, Kwyro; Yang, CY, IEEE ELECTRON DEVICE LETTERS, v.23, no.12, pp.740 - 742, 2002-12

6
Loop-based inductance extraction and modeling for multiconductor on-chip interconnects

Yu, S; Petranovic, DM; Krishnan, S; Lee, Kwyro; Yang, CY, IEEE TRANSACTIONS ON ELECTRON DEVICES, v.53, pp.135 - 145, 2006-01

7
Near-Field Magnetic Induction MIMO Communication Using Heterogeneous Multipole Loop Antenna Array for Higher Data Rate Transmission

Kim, Han-Joon; Park, Jinho; Oh, Kyoung-Sub; Choi, Jihwan P.; Jang, Jae Eun; Choi, Ji-Woong, IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION, v.64, no.5, pp.1952 - 1962, 2016-05

8
Unified model for deep sub-micron on-chip interconnects including non-orthogonal architecture = 비직교형 아키텍쳐를 포함하는 깊은 서브 마이크론 On-chip interconnects 를 위한 통합 모델link

Sim, Sang-Pil; 심상필; et al, 한국과학기술원, 2003

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