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Effects of minor additions of Zn on interfacial reactions of Sn-Ag-Cu and Sn-Cu solders with various Cu substrates during thermal aging Cho, Moon Gi; Kang, Sung K.; Shih, Da-Yuan; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.36, no.11, pp.1501 - 1509, 2007-11 |
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