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The microstructure, thermal fatigue, and failure analysis of near-ternary eutectic Sn-Ag-Cu solder joints Kang S.K.; Lauro P.; Shin D.-Y.; Henderson D.W.; Bartelo J.; Gosselin T.; Cain S.R.; et al, MATERIALS TRANSACTIONS, v.45, no.3, pp.695 - 702, 2004 |
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