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Stresses in electroless Ni-P films for electronic packaging applications Jeon, YD; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.25, no.1, pp.169 - 173, 2002-03 |
The origin of intrinsic stress and its relaxation for SiOF thin films deposited by electron cyclotron resonance plasma-enhanced chemical vapor deposition Kim, SP; Choi, Si-Kyung, THIN SOLID FILMS, v.379, no.1-2, pp.259 - 264, 2000-12 |
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