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Morphological transition of interfacial Ni3Sn4 grains at the Sn-3.5Ag/Ni joint Kim, JH; Jeong, SW; Kim, HD; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.32, no.11, pp.1228 - 1234, 2003-11 |
Staircaselike Suppression of Supersolidity under Rotation Choi, Hyoungsoon; Takahashi, D.; Choi, W.; Kono, K.; Kim, Eunseong, PHYSICAL REVIEW LETTERS, v.108, no.10, 2012-03 |
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