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Enhancement of iodine adsorption on ruthenium glue layer for seedless CECVD of Cu Lee, HB; Kwak, DK; Kang, Sang-Won, ELECTROCHEMICAL AND SOLID STATE LETTERS, v.8, no.2, pp.C39 - C42, 2005 |
Heat-treatment to suppress the formation of Kirkendall voids in Sn-3.5Ag/Cu solder joints Kim, Sung-Hwan; Yu, Jin, MATERIALS LETTERS, v.106, pp.75 - 78, 2013-09 |
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