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Analyses of the practical adhesion strengths of the metal/polymer interfaces in electronic packaging Yu, Jin; Song, JY; Park, IS, JOURNAL OF ELECTRONIC MATERIALS, v.31, no.12, pp.1347 - 1352, 2002-12 |
Interfacial fracture energy measurements in the Cu/Cr/polyimide system Park, YB; Park, IS; Yu, Jin, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.266, no.1-2, pp.261 - 266, 1999-06 |
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