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Showing results 2 to 5 of 5

2
Investigation of isothermal aged Sn-3Ag-0.5Cu/Sn58Bi-Co hybrid solder joints on ENIG and ENEPIG substrate with various mechanical performances

Zhang, Shuai; Qiu, Qingyang; Ding, Tianran; Long, Weimin; Zhong, Sujuan; Paik, Kyung-Wook; He, Peng; et al, MATERIALS TODAY COMMUNICATIONS, v.39, 2024-06

3
Reliable single-phase micro-joints with high melting point for 3D TSV chip stacking

Tian, Ye; Fang, Heng; Ren, Ning; Zhao, Yatao; Chen, Boli; Wu, Fengshun; Paik, Kyung-Wook, JOURNAL OF ALLOYS AND COMPOUNDS, v.828, 2020-07

4
The design of low-temperature solder alloys and the comparison of mechanical performance of solder joints on ENIG and ENEPIG interface

Wang, Shaoan; Chen, Xiangyu; Luo, Keyu; Zhou, Hongzhi; Li, Rongqing; He, Peng; Paik, Kyung-Wook; et al, JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, v.27, pp.5332 - 5339, 2023-11

5
The In-Situ TEM Isothermal Aging Evolution in a μ-Cu/NiAu/Sn/Cu Solder Joint for Full Intermetallic Compounds Interconnects of Flexible Electronics

Liu, Jinhong; Jing, Xinyi; Chen, Jieshi; Paik, Kyung-Wook; He, Peng; Zhang, Shuye, ELECTRONIC MATERIALS LETTERS, v.20, no.3, pp.352 - 361, 2024-05

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