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Adhesion and reliability of anisotropic conductive films (ACFs) joints on organic solderability preservatives (OSPs) metal surface finish Kim,Hyoung-Joon; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.37, pp.1003 - 1011, 2008-07 |
ENIG 표면처리 시 발생되는 Black Pad 현상의 발생기구 및 UBM의 영향에 관한 연구 = A study on the mechanisms of black pad formation and the effects of UBM on black pad after ENIG processlink 김지희; Kim, Ji-Hee; et al, 한국과학기술원, 2011 |
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