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Showing results 195001 to 195020 of 278685
| Technical and Strategic Approaches for CO2 Management in Refining Businesses Roh, Kosan; Lim, Hyungmuk; Yoo, Haeun; Imran, Hasan; Hunaidy, Ali S. Al; Lee, Jay Hyung, SAUDI ARAMCO JOURNAL OF TECHNOLOGY, pp.41 - 50, 2017-05 |
| Technical challenges in Front-End Processes for next generation CMOS devices Cho, Byung Jin, AMSEA ET (Applied Materials South East Asia Engineering & Technology) Conference 2005, pp.0 - 0, 2005-08-07 |
| Technical Challenges of Persistent Association Technology for Ubiquitous Multimedia Kim, JT; Lee, CH; Lee, HY; Lee, Heung-Kyu; Oh, WG, ICAT2004, Int. Conf. on Artificial Reality and Telexistence, pp.177 - 180, 2004 |
| Technical Conceptes and Structure in Development of an Integrating Site and Environment Data Maintenance System Cho, Gyuseong; Yoon, Jeong Hyoun; Yoon, Bong Yo; Kim, Chang-Lak, iSORD4, 2007 |
| Technical description of object and GOF-based(OGB) video compression algorithm for MPEG-4 Kim, Jae Kyoon, MPEG95/M0461, 1995 |
Technical development of transcutaneous electrical nerve inhibition using medium-frequency alternating current Kim, Yushin; Cho, Hang-Jun; Park, Hyung-Soon, JOURNAL OF NEUROENGINEERING AND REHABILITATION, v.15, 2018-08 |
| Technical Issues and Recent Progress on Graphene-based RF MOSFET Cho, Byung Jin, IEEE Topical Symposium on RF Nanotechnology, IEEE, 2012-05 |
| Technical issues in graphene anode organic light emitting diodes Moon, Jaehyun; Shin, Jin-Wook; Cho, Hyunsu; Han, Jun-Han; Cho, Nam Sung; Lim, Jong Tae; Park, Seung Koo; et al, DIAMOND AND RELATED MATERIALS, v.57, pp.68 - 73, 2015-08 |
| Technical Issues of Vacuum Insulation Panels Song, Tae Ho, 8th KSME-JSME Thermal and Fluids Engineering Conference, KSME,JSME, 2012-03-18 |
| Technical note Coordinate systems and integration limits for global flame transfer function calculations Humphrey, Luke; Acharya, Vishal; Shin, Dong-Hyuk; Lieuwen, Tim, INTERNATIONAL JOURNAL OF SPRAY AND COMBUSTION DYNAMICS, v.6, no.4, pp.411 - 416, 2014-12 |
| Technical note numerical simulation of fluid-structure interaction under two-dimensional BVI Kwon, Oh Joon; Oh, WS; Jo, KW, JOURNAL OF THE AMERICAN HELICOPTER SOCIETY, v.49, no.2, pp.212 - 217, 2004-04 |
| Technical Note Numerical Simulation of Fluid-Structure Interaction Under Two-Dimensional BVI Kwon, Oh Joon; Oh, Woo Seop; Jo, Kyu-Won, Journal- American Helicopter Society, Vol.49, No.2, pp.212-217, 2004-04 |
| Technical Note on a Parallel-Facilities Production Planning Model with CapacityConstraints Sung, Chang Sup; j. h. byun, COMPUTERS AND OPERATIONS RESEARCH, v.15, no.6, pp.585 - 587, 1988-01 |
| Technical Note-Branch-and-Price-and-Cut Approach to the Robust Network Design Problem Without Flow Bifurcations Lee, Chungmok; Lee, Kyungsik; Park, Kyungchul; Park, Sungsoo, OPERATIONS RESEARCH, v.60, no.3, pp.604 - 610, 2012-05 |
| Technical Note: Interleaved bipolar acquisition and low-rank reconstruction for water-fat separation in MRI Cho, JaeJin; Park, HyunWook, MEDICAL PHYSICS, v.45, no.7, pp.3229 - 3237, 2018-07 |
| Technical Paper on Microfluidic Devices - Cell Separation Technology Kang, Joo H; Park, Je-Kyun, ASIA PACIFIC BIOTECH NEWS, v.9, no.21, pp.1135 - 1146, 2005-11 |
| Technical papers: Energy efficient topology for wireless microsensor networks Lee, DongMan; Namgoong, H; Nam, D, 2nd ACM international workshop on PE-WASUN 2005, pp.0 - 0, 2005-10 |
| Technical Review: Electromagnetic Sensor System for Localization of Medical Devices Park, CheolJun; Park, Hyunwoo; Choi, Jaesuk; Shin, Hongseok; Jung, Yoontae; Seong, Ho-Yong; Je, Minkyu, International Conference on Consumer Electronics Asia, IEEE, IEIE, 2018-06-25 |
| Technical Review: Interface Integrated Circuits for Metal-Oxide Gas Sensors Seong, Ho-Yong; Kweon, Soon-Jae; Suh, Ji-Hoon; Lee, Jeongeun; Je, Minkyu, International Conference on Consumer Electronics Asia, IEEE, IEIE, 2018-06-25 |
| Technical Review: Neural Recording Circuits for Bidirectional Neural Interface Jung, Yoontae; Jeon, Hyuntak; Lee, Taeju; Park, CheolJun; Seong, Ho-Yong; Je, Minkyu, International Conference on Consumer Electronics Asia, IEEE, IEIE, 2018-06-25 |
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