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Growth kinetics of Cu-Snintermetallic compounds at the interface of a Cu substrate and 42Sn-58Bi electrodeposits, and the influence of the intermetallic compounds on the shear resistance of solder joints Suh, Min-Suk; Park, Chan-Jin; Kwon, Hyuk-Sang, MATERIALS CHEMISTRY AND PHYSICS, v.110, no.1, pp.95 - 99, 2008-07 |
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