Researcher Page

사진

Kim, Sanha (김산하) P-4003-2018 sanhkim@kaist.ac.kr 0000-0002-3548-6173

Department
Department of Mechanical Engineering(기계공학과)
Website
https://sites.google.com/view/amselab/homeHomePage
Research Area
manufacturing; contact mechanics, nano materials; surface engineering, printed electronics

Keyword Cloud

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1

Synthetic Butterfly Scale Surfaces with Compliance‐Tailored Anisotropic Drop Adhesion

Zhao, Hangbo; Park, Sei Jin; Solomon, Brian R.; et al, ADVANCED MATERIALS, v.31, no.14, pp.1807686, 2019-04

2

Stable Wettability Control of Nanoporous Microstructures by iCVD Coating of Carbon Nanotubes

Sojoudi, Hossein; Kim, Sanharesearcher; Zhao, Hangbo; et al, ACS APPLIED MATERIALS & INTERFACES, v.9, no.49, pp.43287 - 43299, 2017-12

3

Ultrathin high-resolution flexographic printing using nanoporous stamps

Kim, Sanharesearcher; Sojoudi, Hossein; Zhao, Hangbo; et al, SCIENCE ADVANCES, v.2, no.12, 2016-12

4

Predictive Synthesis of Freeform Carbon Nanotube Microarchitectures by Strain-Engineered Chemical Vapor Deposition

Park, Sei Jin; Zhao, Hangbo; Kim, Sanharesearcher; et al, SMALL, v.12, no.32, pp.4393 - 4403, 2016-08

5

High-Fidelity Replica Molding of Glassy Liquid Crystalline Polymer Microstructures

Zhao, Hangbo; Wie, Jeong Jae; Copic, Davor; et al, ACS APPLIED MATERIALS & INTERFACES, v.8, no.12, pp.8110 - 8117, 2016-03

6

Three-dimensional machining of carbon nanotube forests using water-assisted scanning electron microscope processing

Rajabifar, Bahram; Kim, Sanharesearcher; Slinker, Keith; et al, APPLIED PHYSICS LETTERS, v.107, no.14, 2015-10

7

Scratching of Patterned Cu/Dielectric Surface Layers by Pad Asperities in CMP

Kim, Sanharesearcher; Saka, Nannaji; Chun, Jung-Hoon, IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, v.28, no.1, pp.96 - 105, 2015-02

8

The Role of Pad Topography in Chemical-Mechanical Polishing

Kim, Sanharesearcher; Saka, Nannaji; Chun, Jung-Hoon, IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, v.27, no.3, pp.431 - 442, 2014-08

9

The Effect of Pad-asperity Curvature on Material Removal Rate in Chemical-mechanical Polishing

Kim, Sanharesearcher; Saka, Nannaji; Chun, Jung-Hoon, Procedia CIRP, v.14, pp.42 - 47, 2014

10

Pad Scratching in Chemical-Mechanical Polishing: The Effects of Mechanical and Tribological Properties

Kim, Sanharesearcher; Saka, Nannaji; Chun, Jung-Hoon, ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, v.3, no.5, pp.P169 - P178, 2014

11

Modeling and mitigation of pad scratching in chemical-mechanical polishing

Kim, Sanharesearcher; Saka, N.; Chun, J. -H.; et al, CIRP ANNALS-MANUFACTURING TECHNOLOGY, v.62, no.1, pp.307 - 310, 2013

12

Hybrid micromachining using a nanosecond pulsed laser and micro EDM

Kim, Sanharesearcher; Kim, Bo Hyun; Chung, Do Kwan; et al, JOURNAL OF MICROMECHANICS AND MICROENGINEERING, v.20, no.1, 2010-01

13

레이저 빔 가공과 방전 가공을 이용한 복합 미세 가공

김산하researcher; 정도관; 오광환; et al, 한국정밀공학회지, v.26, no.10, pp.108 - 115, 2009-10

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