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Kwon, Young-Se (권영세)
명예교수, Department of Electrical Engineering(전기및전자공학부)
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    NO Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
    1
    Thick-Copper-Buried Inductors Using Anodized Aluminum Package Substrates

    Kim, Cheol Ho; Kwon, Young-Seresearcher, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.2, no.8, pp.1260 - 1264, 2012-08

    2
    Low insertion loss K-band BPF using parallel-coupled air-suspended microstrip lines on anodised aluminium substrate

    Yu, Je-In; Kwon, Young-Seresearcher, ELECTRONICS LETTERS, v.48, no.8, pp.437 - 438, 2012-04

    3
    X-band high-power HEMT SPDT switch with selectively anodised aluminium substrate

    Yeo, S. K.; Kwon, Young Seresearcher, ELECTRONICS LETTERS, v.46, no.24, pp.1627 - 1628, 2010-11

    4
    A 3-D X-Band T/R Module Package With an Anodized Aluminum Multilayer Substrate for Phased Array Radar Applications

    Yeo, Sung-Ku; Chun, Jong-Hoon; Kwon, Young Seresearcher, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.33, no.4, pp.883 - 891, 2010-11

    5
    Suspended Spiral Inductor and Band-Pass Filter on Thick Anodized Aluminum Oxide

    Yook, Jong-Min; Kim, Kyoung-Min; Kwon, Young Seresearcher, IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.19, no.10, pp.620 - 622, 2009-10

    6
    Air-Cavity Transmission Lines on Anodized Aluminum for High-Performance RF Modules

    Yook, Jong-Min; Kim, Kyoung-Min; Kwon, Young Seresearcher, IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.19, no.10, pp.623 - 625, 2009-10

    7
    Three-dimensional interconnect for multilayer module packages with selectively anodised aluminium substrate

    Yeo, S. K.; Kwon, Young Seresearcher, ELECTRONICS LETTERS, v.45, no.13, pp.678 - 680, 2009-06

    8
    Micromachined bridge-shaped spiral inductor on anodised aluminium substrate

    Kim, K-M.; Kim, J-H.; Kwon, Young Seresearcher, ELECTRONICS LETTERS, v.45, no.6, pp.311 - 313, 2009-03

    9
    Quasi-Coaxial Vertical via Transitions for 3-D Packages Using Anodized Aluminum Substrates

    Yeo, Sung-Ku; Kim, Kyoung-Min; Chun, Jong-Hoon; et al, IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.19, no.6, pp.365 - 367, 2009

    10
    Aluminum packaging for light-emitting diode using selectively anodizing method

    Kim, Kyoung-Min; Lee, Young Ki; Shin, Sang-Hyun; et al, JAPANESE JOURNAL OF APPLIED PHYSICS, v.47, no.4, pp.2950 - 2953, 2008-04

    11
    Aluminium-based packaging platform for LED using selectively anodising method

    Kim, Kyoung Min; Shin, S. H.; Lee, Y. K.; et al, ELECTRONICS LETTERS, v.44, no.1, pp.24 - 25, 2008-01

    12
    Design and optical characterization of passive pixel with sensitivity-improved InGaAs/InP phototransistors considering light-dependent shunt resistance for near infrared imaging applications

    Jo, Young Chang; Song, Hong Joo; Choi, Yeon Shik; et al, JAPANESE JOURNAL OF APPLIED PHYSICS, v.46, no.9B, pp.6222 - 6226, 2007-09

    13
    Spiral inductors using polymer-core conductors

    Yook, Jong-Min; Kwon, Young Seresearcher, IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.17, no.7, pp.495 - 497, 2007-07

    14
    Ultra-thin pocket embedding package for system in package

    Kim, KM; Sohn, B; Yook, JM; et al, ELECTRONICS LETTERS, v.43, no.6, pp.325 - 327, 2007-03

    15
    Heterojunction bipolar phototransistor with monolithic integrated microlens

    Cho, Seok-Jin; Kim, Jaeho; Kim, Hoon; et al, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS, v.45, no.8A, pp.6285 - 6287, 2006-08

    16
    Grating metal structure with low-K benzocyclobutene and electroplated copper for high-Q spiral inductors

    Yeo, SK; Shin, SH; Kwon, Young Seresearcher, JAPANESE JOURNAL OF APPLIED PHYSICS, v.45, no.4B, pp.2997 - 3001, 2006-04

    17
    High-performance air-buried microstrip lines and Ka-band branch line coupler

    Shin, SH; Jeong, I; Kwon, Young Seresearcher, MICROWAVE AND OPTICAL TECHNOLOGY LETTERS, v.48, no.1, pp.167 - 170, 2006-01

    18
    Silicon nitride two-level-temperature passivation on InP/InGaAsP light-emitting diodes

    Kim, Jacho; Cha, Jung-Ho; Kwon, Young Seresearcher, JAPANESE JOURNAL OF APPLIED PHYSICS, v.45, no.11, pp.8648 - 8649, 2006

    19
    New through-wafer via interconnections with thick oxidized porous silicon sidewall via

    Kim, Bun-Joong; Ha, Man-Lyun; Kwon, Young Seresearcher, JAPANESE JOURNAL OF APPLIED PHYSICS, v.45, no.8A, pp.6141 - 6145, 2006

    20
    High-quality solenoid inductor using dielectric film for multichip modules

    Yook, JM; Ko, JH; Ha, ML; et al, IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, v.53, no.6, pp.2230 - 2234, 2005-06

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