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Kim, Joungho (김정호)
교수, School of Electrical Engineering(전기및전자공학부)
Research Area
EMI/EMC
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    NO Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
    1
    Polynomial Model-Based Eye Diagram Estimation Methods for LFSR-Based Bit Streams in PRBS Test and Scrambling

    Park, Junyong; Kim, Jounghoresearcher; Park, Shinyoung; et al, IEEE Transactions on Electromagnetic Compatibility, v.61, no.6, pp.1867 - 1875, 2019-12

    2
    Fast and Accurate Power Distribution Network Modeling of a Silicon Interposer for 2.5-D/3-D ICs With Multiarray TSVs

    Cho, Kyungjun; Kim, Youngwoo; Kim, Subin; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.9, no.9, pp.1835 - 1846, 2019-09

    3
    A Novel Eye-Diagram Estimation Method for Pulse Amplitude Modulation With N-Level (PAM-N) on Stacked Through-Silicon Vias

    Park, Junyong; Jung, Daniel H.; Kim, Byunggon; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.61, no.4, pp.1198 - 1206, 2019-08

    4
    Low Leakage Electromagnetic Field level and High Efficiency using A Novel Hybrid Loop-array Design for Wireless High Power Transfer System

    Lee, Seongsoo; Kim, Dong-Hyun; Cho, Yeonje; et al, IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS, v.66, no.6, pp.4356 - 4367, 2019-06

    5
    Smartwatch Strap Wireless Power Transfer System with Flexible PCB Coil and Shielding Material

    Jeong, Seungtaek; Kim, Dong-Hyun; Song, Jinwook; et al, IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS, v.66, no.5, pp.4054 - 5064, 2019-05

    6
    Design and Measurement of a Novel On-Interposer Active Power Distribution Network for Efficient Simultaneous Switching Noise Suppression in 2.5-D/3-D IC

    Kim, Subin; Kim, Youngwoo; Cho, Kyungjun; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.9, no.2, pp.317 - 328, 2019-02

    7
    Signal Integrity Design and Analysis of Differential High-Speed Serial Links in Silicon Interposer With Through-Silicon Via

    Cho, Kyungjun; Kim, Youngwoo; Lee, Hyunsuk; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.9, no.1, pp.107 - 121, 2019-01

    8
    Modeling and Analysis of TSV Noise Coupling Effects on RF LC-VCO and Shielding Structures in 3D IC

    Lim, Jaemin; Cho, Jonghyun; Jung, Daniel Hyunsuk; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.60, no.6, pp.1939 - 1947, 2018-12

    9
    High-Frequency Electrical Characterization of a New Coaxial Silicone Rubber Socket for High-Bandwidth and High-Density Package Test

    Park, Junyong; Kim, Hyesoo; Kim, Jonghoon J.; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.8, no.12, pp.2152 - 2162, 2018-12

    10
    A Novel Stochastic Model-Based Eye-Diagram Estimation Method for 8B/10B and TMDS-Encoded High-Speed Channels

    Park, Junyong; Choi, Sumin; Kim, Jonghoon J.; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.60, no.5, pp.1510 - 1519, 2018-10

    11
    EMI Reduction Methods in Wireless Power Transfer System for Drone Electrical Charger using Tightly-coupled Three-phase Resonant Magnetic Field

    Song, Chiuk; Kim, Hongseok; Kim, Youngwoo; et al, IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS, v.65, no.9, pp.6839 - 6849, 2018-09

    12
    Signal Integrity Design and Analysis of Silicon Interposer for GPU-Memory Channels in High-Bandwidth Memory Interface

    Cho, Kyungjun; Kim, Youngwoo; Lee, Hyunsuk; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.8, no.9, pp.1658 - 1671, 2018-09

    13
    Thin Hybrid Metamaterial Slab With Negative and Zero Permeability for High Efficiency and Low Electromagnetic Field in Wireless Power Transfer Systems

    Cho, Yeonje; Lee, Seongsoo; Kim, Dong-Hyun; et al, IEEE Transactions on Electromagnetic Compatibility, v.60, no.4, pp.1001 - 1009, 2018-08

    14
    Design of an On-Silicon-Interposer Passive Equalizer for Next Generation High Bandwidth Memory With Data Rate Up To 8 Gb/s

    Jeon, Yeseul; Kim, Heegon; Kim, Jounghoresearcher; et al, IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS, v.65, no.7, pp.2293 - 2303, 2018-07

    15
    Miniaturized and high-performance RF packages with ultra-thin glass substrates

    Kim, Min Suk; Pulugurtha, Markondeya Raj; Kim, Youngwoo; et al, MICROELECTRONICS JOURNAL, v.77, pp.66 - 72, 2018-07

    16
    Modeling, Measurement, and Analysis of Audio Frequency Ground Integrity for a TDMA Smartphone System

    Park, Shinyoung; Song, Jinwook; Kim, Subin; et al, IEEE Transactions on Components, Packaging and Manufacturing Technology, v.8, no.4, pp.519 - 530, 2018-04

    17
    High-Resolution Synthesized Magnetic Field Focusing for RF Barcode Applications

    Kim, Min Woo; Kim, Jihoon; Cho, Yeonje; et al, IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS, v.65, no.1, pp.597 - 607, 2018-01

    18
    Localization of Short and Open Defects in Multilayer Through Silicon Vias (TSV) Daisy-Chain Structures

    Piersanti, Stefano; de Paulis, Francesco; Olivieri, Carlo; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.59, no.5, pp.1558 - 1564, 2017-10

    19
    Glass-Interposer Electromagnetic Bandgap Structure With Defected Ground Plane for Broadband Suppression of Power/Ground Noise Coupling

    Kim, Youngwoo; Cho, Jonghyun; Cho, Kyungjun; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.9, pp.1493 - 1505, 2017-09

    20
    Miniaturized Bandpass Filters as Ultrathin 3-D IPDs and Embedded Thinfilms in 3-D Glass Modules

    Sitaraman, Srikrishna; Sukumaran, Vijay; Pulugurtha, Markondeya Raj; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.9, pp.1410 - 1418, 2017-09

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