Application of reflow soldering method for laminated high temperature superconductor tapes

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A lamination system using reflow soldering was developed to enhance the mechanical properties of high temperature superconductor (HTS) tape. The laminated coated conductor tape was fabricated using the continuous lamination process. The mean, maximum, and minimum tensile loads in a T-peel test of the laminated coated conductor were 9.9 N, 12.5 N, and 7.6 N, respectively. The critical current (I c) distributions of the non-laminated and laminated coated conductor were compared using a non-contact Hall probe method. The transport I c nearly matched the non-contact I c; however, some degraded I c regions were found on the length of 800 cm of laminated coated conductor. We confirmed that the cause of the partially degraded I c was due to an increase in line tension by (1) solidification induced by a change of composition that usually occurs in molten brass (Cu, Zn) in solder, or (2) non-homogeneity of the thickness of the coated conductor or metal tapes. We suggest that reflow soldering is a promising method for reinforced HTS tape if the controlling solder thickness and lamination guide are modified.
Publisher
Korea Institute of Applied Superconductivity and Cryogenics
Issue Date
2010-05
Language
English
Citation

JOURNAL OF THE KOREA INSTITUTE OF APPLIED SUPERCONDUCTIVITY AND CRYOGENICS, v.12, no.2, pp.9 - 12

ISSN
1229-3008
URI
http://hdl.handle.net/10203/99686
Appears in Collection
PH-Journal Papers(저널논문)
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