Molecular simulation study on adhesions and deformations for Polymethyl Methacrylate (PMMA) resist in nanoimprint lithography

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The NIL (nanoimprint lithography) process is explored through numerical simulation, utilizing MD (molecular dynamics), with a focus on the resin deformations and the adhesion between the resin material and the tool. For the force-field of the Polymethyl Methacrylate (PMMA), used for the resin material, a united atom model is employed. For temperature control in the MD simulation, the recursive multiple chains of the Nose-Poincare thermostat is applied. The deformation and adhesion in the NIL process are explored from the mechanics viewpoint based on the present MD results. In particular, the adhesion behavior of a self-assembly monolayer (SAM) in the stamp-releasing stage is discussed in connection with the monolayer thickness.
Publisher
KOREAN SOC MECHANICAL ENGINEERS
Issue Date
2011-09
Language
English
Article Type
Article
Keywords

CHEMICAL FORCE MICROSCOPY; FLASH IMPRINT LITHOGRAPHY; DYNAMICS SIMULATIONS; DEFECT ANALYSIS; FORMULATION; FIELD; STEP

Citation

JOURNAL OF MECHANICAL SCIENCE AND TECHNOLOGY, v.25, no.9, pp.2311 - 2322

ISSN
1738-494X
URI
http://hdl.handle.net/10203/95746
Appears in Collection
ME-Journal Papers(저널논문)
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