DC Field | Value | Language |
---|---|---|
dc.contributor.author | Choi, ST | ko |
dc.contributor.author | Song, JY | ko |
dc.contributor.author | Kim, JH | ko |
dc.contributor.author | Lee, S | ko |
dc.contributor.author | Earmme, Youn-Young | ko |
dc.date.accessioned | 2013-03-06T23:26:19Z | - |
dc.date.available | 2013-03-06T23:26:19Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2006-03 | - |
dc.identifier.citation | KEY ENGINEERING MATERIALS, v.306-308, pp.1337 - 1342 | - |
dc.identifier.issn | 1013-9826 | - |
dc.identifier.uri | http://hdl.handle.net/10203/88807 | - |
dc.description.abstract | The GaAs wafer bonding process is investigated to reduce the mechanical failures of GaAs wafer based on strength design concept. Three-point bending experiment is performed to measure the fracture strength of GaAs wafer, of which cleavage takes place on (110) plane. We propose a simple method for minimizing the thermal residual stress in a three-layer structure, of which the basic idea is to use an appropriate steady-state temperature gradient to the wafer bonding process. The optimum bonding condition of GaAs/wax/sapphire structure is determined based on the proposed method. The effect of material anisotropy on the thermal residual stress is also analyzed by finite element method. | - |
dc.language | English | - |
dc.publisher | Trans Tech Publications Ltd. | - |
dc.title | Strength design and minimization of residual stresses in reversible GaAs wafer bonding process | - |
dc.type | Article | - |
dc.identifier.wosid | 000236852900223 | - |
dc.identifier.scopusid | 2-s2.0-33644861442 | - |
dc.type.rims | ART | - |
dc.citation.volume | 306-308 | - |
dc.citation.beginningpage | 1337 | - |
dc.citation.endingpage | 1342 | - |
dc.citation.publicationname | KEY ENGINEERING MATERIALS | - |
dc.contributor.localauthor | Earmme, Youn-Young | - |
dc.contributor.nonIdAuthor | Choi, ST | - |
dc.contributor.nonIdAuthor | Song, JY | - |
dc.contributor.nonIdAuthor | Kim, JH | - |
dc.contributor.nonIdAuthor | Lee, S | - |
dc.type.journalArticle | Article; Proceedings Paper | - |
dc.subject.keywordAuthor | reversible wafer bonding process | - |
dc.subject.keywordAuthor | fracture strength | - |
dc.subject.keywordAuthor | thermal residual stress | - |
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