DC Field | Value | Language |
---|---|---|
dc.contributor.author | Lee, Jong-Bum | ko |
dc.contributor.author | Koo, Ja-Myeong | ko |
dc.contributor.author | Hong, Soon-Min | ko |
dc.contributor.author | Shin, Hyoyoung | ko |
dc.contributor.author | Moon, Youn-jin | ko |
dc.contributor.author | Jung, Jae-Pil | ko |
dc.contributor.author | Yoo, Choon-Don | ko |
dc.contributor.author | Jung, Seung-Boo | ko |
dc.date.accessioned | 2013-03-06T21:52:17Z | - |
dc.date.available | 2013-03-06T21:52:17Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2008-05 | - |
dc.identifier.citation | JAPANESE JOURNAL OF APPLIED PHYSICS, v.47, no.5, pp.4300 - 4304 | - |
dc.identifier.issn | 0021-4922 | - |
dc.identifier.uri | http://hdl.handle.net/10203/88588 | - |
dc.description.abstract | In this study, two electrodes between a flexible printed circuit board (FPCB) and a rigid PCB (RPCB) are bonded using longitudinal ultrasonic vibration. The surface finish of the electrode of the RPCB is fixed as an electroless Ni/immersion ALL (ENIG), whereas two different surface finishes, are employed for the FPCB: immersion Sn and ENIG. Electrodes of the RPCB and FPCB are successfully bonded using longitudinal ultrasonic vibration. While a continuous intermetallic compound (IMC) of(Cu(x)AU(1-x))(6)Sn(5) is formed at the ENIG/Sn interface, a Au-Ni-P reaction layer is formed with an un-bonded region at the ENIG/ENIG interface. The peel strength of the ENIG/Sn joint is higher than that of the ENIG/FNIG joint. Results of peel tests show that the bonding conditions have a significant effect on joint integrity. [DOI: 10.1143/JJAP.47.4300] | - |
dc.language | English | - |
dc.publisher | Japan Soc Applied Physics | - |
dc.subject | BUMP | - |
dc.title | Longitudinal Ultrasonic Bonding of Electrodes between Rigid and Flexible Printed Circuit Boards | - |
dc.type | Article | - |
dc.identifier.wosid | 000256462700108 | - |
dc.identifier.scopusid | 2-s2.0-54949126011 | - |
dc.type.rims | ART | - |
dc.citation.volume | 47 | - |
dc.citation.issue | 5 | - |
dc.citation.beginningpage | 4300 | - |
dc.citation.endingpage | 4304 | - |
dc.citation.publicationname | JAPANESE JOURNAL OF APPLIED PHYSICS | - |
dc.contributor.localauthor | Yoo, Choon-Don | - |
dc.contributor.nonIdAuthor | Lee, Jong-Bum | - |
dc.contributor.nonIdAuthor | Koo, Ja-Myeong | - |
dc.contributor.nonIdAuthor | Hong, Soon-Min | - |
dc.contributor.nonIdAuthor | Shin, Hyoyoung | - |
dc.contributor.nonIdAuthor | Moon, Youn-jin | - |
dc.contributor.nonIdAuthor | Jung, Jae-Pil | - |
dc.contributor.nonIdAuthor | Jung, Seung-Boo | - |
dc.type.journalArticle | Article; Proceedings Paper | - |
dc.subject.keywordAuthor | ultrasonic bonding | - |
dc.subject.keywordAuthor | flexible printed circuit board (FPCB) | - |
dc.subject.keywordAuthor | rigid printed circuit board (RPCB) | - |
dc.subject.keywordAuthor | immersion Sn | - |
dc.subject.keywordAuthor | electroless Ni/immersion Au (ENIG) | - |
dc.subject.keywordAuthor | peel test | - |
dc.subject.keywordAuthor | intermetallic compound (IMC) | - |
dc.subject.keywordPlus | BUMP | - |
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