Longitudinal Ultrasonic Bonding of Electrodes between Rigid and Flexible Printed Circuit Boards

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dc.contributor.authorLee, Jong-Bumko
dc.contributor.authorKoo, Ja-Myeongko
dc.contributor.authorHong, Soon-Minko
dc.contributor.authorShin, Hyoyoungko
dc.contributor.authorMoon, Youn-jinko
dc.contributor.authorJung, Jae-Pilko
dc.contributor.authorYoo, Choon-Donko
dc.contributor.authorJung, Seung-Booko
dc.date.accessioned2013-03-06T21:52:17Z-
dc.date.available2013-03-06T21:52:17Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued2008-05-
dc.identifier.citationJAPANESE JOURNAL OF APPLIED PHYSICS, v.47, no.5, pp.4300 - 4304-
dc.identifier.issn0021-4922-
dc.identifier.urihttp://hdl.handle.net/10203/88588-
dc.description.abstractIn this study, two electrodes between a flexible printed circuit board (FPCB) and a rigid PCB (RPCB) are bonded using longitudinal ultrasonic vibration. The surface finish of the electrode of the RPCB is fixed as an electroless Ni/immersion ALL (ENIG), whereas two different surface finishes, are employed for the FPCB: immersion Sn and ENIG. Electrodes of the RPCB and FPCB are successfully bonded using longitudinal ultrasonic vibration. While a continuous intermetallic compound (IMC) of(Cu(x)AU(1-x))(6)Sn(5) is formed at the ENIG/Sn interface, a Au-Ni-P reaction layer is formed with an un-bonded region at the ENIG/ENIG interface. The peel strength of the ENIG/Sn joint is higher than that of the ENIG/FNIG joint. Results of peel tests show that the bonding conditions have a significant effect on joint integrity. [DOI: 10.1143/JJAP.47.4300]-
dc.languageEnglish-
dc.publisherJapan Soc Applied Physics-
dc.subjectBUMP-
dc.titleLongitudinal Ultrasonic Bonding of Electrodes between Rigid and Flexible Printed Circuit Boards-
dc.typeArticle-
dc.identifier.wosid000256462700108-
dc.identifier.scopusid2-s2.0-54949126011-
dc.type.rimsART-
dc.citation.volume47-
dc.citation.issue5-
dc.citation.beginningpage4300-
dc.citation.endingpage4304-
dc.citation.publicationnameJAPANESE JOURNAL OF APPLIED PHYSICS-
dc.contributor.localauthorYoo, Choon-Don-
dc.contributor.nonIdAuthorLee, Jong-Bum-
dc.contributor.nonIdAuthorKoo, Ja-Myeong-
dc.contributor.nonIdAuthorHong, Soon-Min-
dc.contributor.nonIdAuthorShin, Hyoyoung-
dc.contributor.nonIdAuthorMoon, Youn-jin-
dc.contributor.nonIdAuthorJung, Jae-Pil-
dc.contributor.nonIdAuthorJung, Seung-Boo-
dc.type.journalArticleArticle; Proceedings Paper-
dc.subject.keywordAuthorultrasonic bonding-
dc.subject.keywordAuthorflexible printed circuit board (FPCB)-
dc.subject.keywordAuthorrigid printed circuit board (RPCB)-
dc.subject.keywordAuthorimmersion Sn-
dc.subject.keywordAuthorelectroless Ni/immersion Au (ENIG)-
dc.subject.keywordAuthorpeel test-
dc.subject.keywordAuthorintermetallic compound (IMC)-
dc.subject.keywordPlusBUMP-
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