Ultra-thin pocket embedding package for system in package

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Proposed is a new type of packaging technology, 'pocket embedding package', using selectively anodised aluminium substrate. In this technology, chips can be embedded inside aluminium substrate so that an ultra-thin and compact type of package can be achieved. A monolithic microwave integrated circuit dice with 120 mu m thickness has been successfully embedded inside the substrate with a tolerance of less than 5 pm, and 300 mu m of total thickness can be achieved with excellent thermal dissipation.
Publisher
INSTITUTION ENGINEERING TECHNOLOGY-IET
Issue Date
2007-03
Language
English
Article Type
Article
Citation

ELECTRONICS LETTERS, v.43, no.6, pp.325 - 327

ISSN
0013-5194
DOI
10.1049/el:20073758
URI
http://hdl.handle.net/10203/88438
Appears in Collection
EE-Journal Papers(저널논문)
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