Aluminium-based packaging platform for LED using selectively anodising method

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An aluminium-based packaging platform with microreflector and electrical via for an interconnection electrode is first proposed for a package component of a light-emitting diode (LED). The electrode-guided interconnection with 180 mm thickness has been successfully fabricated by using the selectively anodising process, and not by either the plating or the solder paste technique. The reflector was formed during the isotropic etching process. By mainly a two-step chemical process, the LED packaging platform integrated microreflector and electrical via in one body was developed in a low-cost process.
Publisher
INST ENGINEERING TECHNOLOGY-IET
Issue Date
2008-01
Language
English
Article Type
Article
Citation

ELECTRONICS LETTERS, v.44, no.1, pp.24 - 25

ISSN
0013-5194
DOI
10.1049/el:20081391
URI
http://hdl.handle.net/10203/87798
Appears in Collection
ME-Journal Papers(저널논문)EE-Journal Papers(저널논문)
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