Browse "College of Engineering(공과대학)" by Type Conference

Showing results 63241 to 63260 of 90910

63241
Slope Stability Analysis by Optimization Technique considering Unsaturated Strength and SWCC

Lee, Seung Rae; Lee, S.J; Byeon, W.Y; Chang, B.S, KKNN Symposium on Civil Engineering, pp.563 - 568, 2001-11

63242
Slope surface treatment using a bio-soil approach

Im, Jooyoung; Kwon, Yeong-Man; Chang, Ilhan; Cho, Gye-Chun, 11ICG, Korean Geosynthetics Society, 2018-09-19

63243
Slope-Based Histogram Equalization for Real-Time Display of High-Quality Infrared Imagery

Lee, Seung Youn; Kim, Dae Yeong; Kim, Changick, International Conference on Consumer Electronics(ICCE) ASIA, IEEE/IEIE, 2018-06-25

63244
Sloping profile and pattern transfer to silicon

Jeon, J.-W.; Yoon, Jun-Bo; Lim, Koeng Su, Pacific Conference of Transducers and Micro-Nano Technology 2006., 2006-06

63245
Sloshing flow with cylindrical structures in a rectangular tank; f-PIV vs. SPH

김기종; 서현덕; 김대겸, 대한조선학회 2021년 춘계학술대회, 대한조선학회, 2021-05-14

63246
Sloshing loads in rectangular tank according to motion characteristics and filling levels

우성민; 김현조; 김주성; 김대겸, 제12회 한국유체공학학술대회, 한국전산유체공학회, 2022-06-24

63247
Sloshing 영향을 고려한 직사각형 유체저장조의 내진해석

윤정방, 한국전산구조공학회 학술발표회, 한국전산구조공학회, 1994-01-01

63248
Slot array antenna using a rectangular waveguide partially filled with a ferrite slab

Hwang, K.C.; Eom, Hyo Joon, 2006 IEEE International Workshop on Antenna Technology, IWAT 2006, pp.412 - 415, 2006-03-06

63249
Slot transmission line model of interconnections crossing split power/ground plane on high-speed multi-layer board

Kim, Joungho; Kim, H.; Jeong, Y.; Lee, J.; Kim, J., 6th IEEE Workshop on Signal Propagation on Interconnects, SPI, pp.23 - 26, 2002-05-12

63250
Slots on Ground Fillings of Multi-layer Printed Circuit Board for Suppressing Indirect Crosstalk between Digital Clock Line and RF Signal Line in Mixed Mode Mobile Systems

Pak, Jun So; Hong, Frank; Kim, Austin; Kim, Joungho; Kim, Gawon, Presented at Proceeding of 2008 IEEE EMC Symposium, pp.1 - 6, IEEE, 2008-10-14

63251
Slotted DS-CDMA System to Guarantee QoS requirements in Wireless Packet (ATM) Networks

Sung, Dan Keun; Chang, JW; Ahn, JH; Kim, JH, Int. Symposium on Personal, Indoor and Mobile Radio Communications (PIMRC'99), 1999

63252
Slotted DS-CDMA System to Guarantee QoS Requirements in Wireless Packet (ATM) Networks

Sung, Dan Keun; Chang, SC, Int. Conf. on Telecommunications (ICT'99), pp.389 - 393, 1999

63253
Slow Crystallization Process of a Thermotropic Liqid CrystallinePolyesteramide

Chung, In Jae, 34th IUPAC Congress, 1993

63254
Slow Display

Saakes, Daniel Pieter; Kevin Chiu; Tyler Hutchison; Biyeun M. Buczyk; Naoya Koizumi; Masahiko Inami; Ramesh Raskar, SIGGRAPH 2010, no.22, ACM Siggraph SIGGRAPH '10 ACM SIGGRAPH 2010 Emerging Technologies, 2010-07

63255
Slow is Fast: Rethinking In-Memory Graph Analysis with Persistent Memory

Bae, Hanyeoreum; Kwon, Miryeong; Gouk, Donghyun; Han, Sanghyun; Koh, Sungjoon; Lee, Changrim; Park, Dongchul; et al, 13rd Annual Non-Volatile Memories Workshop (NVMW), 2022, University of California, San Diego, 2022-05-09

63256
Slow Robots for Unobtrusive Posture Correction

Shin, Joon Gi; Onchi, Eiji; Reyes, Maria Jose; Song, Junbong; Lee, Uichin; Lee, Seung-Hee; Saakes, Daniel Pieter, 2019 CHI Conference on Human Factors in Computing Systems, CHI 2019, pp.613:1 - 613:10, ACM SIGCHI, 2019-05-07

63257
Slow saccades characterize frontotemporal dementia with motor neuron disease

Jeong, Yong; Moon, SY; Lee, BH; Na, DL, J Korean Neurol Assoc. , J Korean Neurol Assoc., 2006

63258
Slow scanning electromagnetic MEMS scanner for laser display

Jeong, Hee-Moon; Park, Yong-Hwa; Jeong, Hyun-Ku; Cho, Yong-Chul; Chang, Seok-Mo; Kim, Jun-O; Kang, Seok-Jin; et al, MOEMS and Miniaturized Systems VII, SPIE Photonics West, 2008-01-22

63259
Slow Viscous Flow Past a Circular Arc

Choi, Do Hyung; Kim, Moon Uhn, KSME/JSME THERMAL and FLUID Engineering Conference , pp.224 - 229, 1994-01

63260
Slow wave and dielectric quasi-TEM modes of metal-insulator-semiconductor (MIS) structure through silicon via (TSV) in signal propagation and power delivery in 3D chip package

Pak, Jun So; Cho, J.; Kim, J.; Lee, J.; Lee, H.; Park, K.; Kim, Joungho, 60th Electronic Components and Technology Conference, ECTC 2010, pp.667 - 672, ECTC 2010, 2010-06-01

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