Browse "College of Engineering(공과대학)" by Type Conference
Showing results 44401 to 44420 of 90910
| Mechanical Reliability of Advanced Thin Films Kim, Taek-Soo, JSME-CMD International Computational Mechanics Symposium, JSME-CMD, 2012-10-11 |
| Mechanical Reliability of Advanced Thin Films Kim, Taek-Soo, 14th International Conference on Modern Materials and Technologies, The National Research Council of Italy, 2018-06-10 |
| Mechanical Reliability of Advanced Thin Films Kim, Taek-Soo, 대한금속재료학회 2015년 춘계학술대회, 대한금속재료학회, 2015-04-23 |
| Mechanical Reliability of Advanced Thin Films Kim, Taek-Soo, International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IACC 2015), International Conference on Electronic Packaging, 2015-04-16 |
| Mechanical Reliability of Advanced Thin Films 김택수, 2013 the Korean Microelectronics and Packaging Society Meeting, Korean Microelectronics and Packaging Society, 2013-11-14 |
| Mechanical Reliability of Advanced Thin Films Kim, Taek-Soo, ENGE2014 Meeting, ENGE, 2014-11-16 |
| Mechanical Reliability of Advanced Thin Films for Flexible Devices Kim, Taek Soo, 2016 International Conference on Electronics Packaging, International Conference on Electronics Packaging, 2016-04-22 |
| Mechanical Reliability of Cu/Low-k Interconnects and Underfill Yoon, Taeshik; Lee, Inhwa; Kim, Taek-Soo, IEEE International 3D System Integration Conference, IEEE, 2012-02-02 |
| Mechanical Reliability of Electronics Packaging Lee, Soon-Bok; Ham, SJ, pp.3 - 45, 2001 |
| Mechanical reliability of fiber Bragg gratings for strain or temperature sensor Yoon, Hyuk-Jin; Park, Sang-Oh; Kim, Chun-Gon, in Proc. of Japan International SAMPE Symposium 2005, pp.1096-1101, SAMPE, 2005-11 |
| Mechanical Reliability of Flip-Chip Packaging: from Cu/Low-k Interconnects to Underfill Kim, Taek-Soo, Korea-SV Electronics Packaging Technology Workshop, Korea-SV Electronics Packaging Technology Workshop, 2010-10-21 |
| Mechanical Reliability of Flip-Chip Packaging: from Cu/Low-k Interconnects to Underfill Kim, Taek-Soo, The 10th International Symposium on Microelectronics and Packaging, Korean Microelectronics and Packaging Society, 2011-10-12 |
| Mechanical Reliability of Flip-Chip Packaging: from Cu/Low-k Interconnects to Underfill 김택수, MPC2011 Autumn Symposium, MPC, 2011-10-14 |
| Mechanical Self-assemvly at Soft Interfaces 김필남, 2012 The 2nd Young Scientist Forum of Bioamaterial Research , 한국생체재료학회, 2012-12-06 |
| Mechanical sensor for the clearance depth control of a non-explosive demining system Kwak, Yoon Keun, 1st International Conference on Sensing Technology(ICST 2005), pp.678 - 682, ICST, 2005-11-01 |
| Mechanical stability enhancement of platinum black microelectrodes for neural sensor 김래영; 남윤기, 한국뇌신경과학회 추계학술대회, 한국뇌신경과학회, 2013-09-25 |
| Mechanical stimulation induce fibroblast maturation and skin regeneration Ko, Ung Hyun; Choi, Jong-Jin; Choung, Jin Seung; Han, Je-Hyun; Moon, Sung-Hwan; Shin, Jennifer Hyunjong, 대한생체역학회 2016 추계학술대회, 대한생체역학회, 2016-09 |
| Mechanical Strength Experiments of Carbon/Carbon Brake Disk Yoo, Jae-seok; Sung, Dae-un; Hong, Chang Sun; Kim, Chun-Gon; Kim, KS, Asian-Australasian Conference on Composite Materials(ACCM-2), pp.715 - 720, ACCM, 2000-08 |
| Mechanical stress effects on the lithiation behavior of tin nanoparticles revealed by in situ graphene liquid cell transmission electron microscopy Seo, Hyeon Kook; Sangtae Kim; Park, Jae Yeol; Chang, Joon Ha; Sung Joo Kim; Jae Won Shin; Yuk, Jong Min, EAMC3, Korea Society of Microscopy, 2017-11-08 |
| Mechanical test for design and evaluation of pushbutton-activated microfluidic devices 한동현; 이기현; 오운택; 박주환; 박제균, 2022 마이크로나노시스템학회 추계학술대회, 마이크로나노시스템학회, 2022-11-17 |
Discover
Open Access
Date issued
- 22,777 2020 - 2024
- 75,403 2010 - 2019
- 57,262 2000 - 2009
- 30,842 1990 - 1999
- 9,025 1980 - 1989