Browse "College of Engineering(공과대학)" by Type Conference

Showing results 68561 to 68580 of 90865

68561
The Effect of Total Pressure in Continuous Flow Condensation Aerosol Generator

Kim, Sang Soo; Kim, YK, Proceedings of the 4th International Aerosol Conference, pp.599 - 599, 1994-08-28

68562
The effect of transcranial magnetic stimulation on fear memory extinction of rats

Jeong, Jaeseung; Baek, Kwangyeol; Chae, Jeong-Ho, 37th annual meeting of the Society for Neuroscience, 2007

68563
The effect of transient traffic conditions on drivers’ car-following behavior after lane-changing events

Kim, Kwangho; Oh, Simon; Yeo, Hwasoo, THE 25 KKCNN SYMPOSIUM ON CIVIL ENGNEERING, KAIST, 2012-10-23

68564
The effect of transverse conduction on the oscillation flow and the thermal performance of a micro flat plate pulsating heat pipe

Yoon, Aejung; Kim, Sung Jin, The 26th International Symposium on Transport Phenomena, Montan University, Tokyou University of Science, TPT, ISTP, 2015-09-29

68565
The effect of transverse magnetic field on macrosegregation in vertical Bridgman crystal growth of Te doped InSb

이진형, 한국결정성장학회, pp.96 - 96, 1996

68566
The effect of Treatment of Vapor Premeate on Flux in Membrane Distillation

Lee, CH; Hong, Won-Hi, The Korea Institute of Chemical Engineers and The Society of Separation Process Engineers and Japan and The Division of Separation Technology orea-Chi, pp.0 - 0, 1999-08-01

68567
The Effect of User Mobility in Rectangular Shaped Urban Micro-Cellular Systems

Sung, Dan Keun; Cho, HS; Kim, YW; Jhee, YK, APCC, 1995

68568
The effect of vapor grown carbon fiber as an additive for anode catalyst in direct methanol fuel cell

홍원희, 2006 추계한국탄소학회, 한국탄소학회, 2006-11-01

68569
The effect of various microstructures on crack propagation in heterogeneous media

Im, Seyoung, International Conference on Fracture and Damage Mechanics, 2008-09-11

68570
The effect of various wafer thicknesses on hot spot temperature

Kyo, S.C.; Il, Y.H.; Kim, SungJin, 2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, I-THERM, pp.428 - 431, 2008-05-28

68571
The Effect of Vibration on Critical Heat Flux in a Vertical Round Tube

Lee, Y.H.; Chang, Soon-Heung, The 3rd Korea-Japan Symposium on Nuclear Thermal Hydraulics and Safety, v.40, no.10, pp.734 - 743, 2002

68572
The Effect of Video Loading Symbol on Waiting Time Perception

Kim, Woojoo; Xiong, Shuping, HCI International 2017, Constantine Stephanidis, 2017-07-14

68573
The Effect of volume expansion on the flame-vortex interaction

Kwon, Sejin, 한국전산유체공학회, pp.78 - 86, 한국전산유체공학회, 1998-01

68574
The Effect of volume expansion on the Propagation of wrinkled laminar premixed flame

Chung, E.H.; Kwon, Sejin, AIAA/ASME/ASEE Joint Propulsion Meeting, AIAA, 1998-01

68575
The Effect of volume expansion on the propagation of Wrinkled laminar premixed flame

Chung, E.H.; Kwon, Sejin, 한국연소학회 1998년도 제17회 KOSCI SYMPOSIUM, pp.139 - 154, The Korean Society of Combustion, 1998-10

68576
The effect of water and temperature on DME steam reforming over hybrid nano-catalysts (Cu/ZnO/Al2O3 and Al-SBA-15)

Ihm, Son Ki, ISNNM8, 2007-02-23

68577
The effect of water contents on the properties of cellulose fiber spun from the solutions of cellulose/4-methylmorpholine-N-oxide/water

Kim, Jong Duk; Chun, SW; Cho, SM; Lee, HS, Chungnam-Kyushu Symposium, korean institute of chemical engineers, 1992-11-19

68578
The effect of wire drawing and aging on mechanical and electrical properties of Cu-Cr-Zr alloy

Joo, HS; Kim, YN; Hwang, SK; Im, Yong-Taek, International Conference on the Technology of Plasticity, ICTP 2017, pp.1129 - 1134, Elsevier BV, 2017-09

68579
The Effect on Monostatic RCS by Gap-Fill with Epoxy/MWCNT in Groove Pattern

최원호; 장홍규; 신재환; 송태훈; 김천곤, 2011년도 추계 마이크로파 및 전파 학술대회, 한국통신학회 마이크로파 및 전파연구회, 2011-09-23

68580
The Effective Design Approach of Radar Absorbing Leading Edge Structure of Airfoil

Choi, Won Ho; Jang, Hong Kyu; Shin, Jae Hwan; Song, Tae Hoon; Kim, Jin-Kyu; Kim, Jin Bong; Joo, Young-Sik; et al, ISAP 2012, Communications Society of the Institute of Electronics, Information and Communication Engineers (IEICE), 2012-10-31

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