Browse "College of Engineering(공과대학)" by Type Conference

Showing results 43161 to 43180 of 90911

43161
Low power, tunable active inductor and its applications to monolithic VCO and BPF

Ko, Jin-Su; Lee, Kwyro, Proceedings of the 1997 IEEE MTT-S International Microwave Symposium. Part 1 (of 3), v.2, pp.929 - 932, IEEE, 1997-06-08

43162
Low pressure operation of sulfur-iodine cycle in VHTR through the concept of heat exchanging-pressure depressurizing loop

Kim, Y.S.; No, Hee Cheon; Yoon, H.J.; Lee, JeongIk, 2nd International Topical Meeting on Safety and Technology of Nuclear Hydrogen Production, Control, and Management 2010, pp.68 - 74, 2010-06-13

43163
Low Rate WPAN Technologies and Standards

Kim, Daeyoung; Doh, Y.; Yoo, S.; Chang, K.; Park, W.; Seo, C., KISS, pp.0 - 0, 2004-12

43164
Low RCS Patch Antenna with Electromagnetic Bandgap using a Conducting Polymer

Jang, H.-K.; Shin, J.-H.; Kim, Chun-Gon, 2010 12th International Conference on Electromagnetics in Advanced Applications, ICEAA'10, pp.140 - 143, 2010-09-20

43165
Low Resistance ALD-NiGe Contact with Phosphorus Segregation on n-Type Germanium

안현준; 문정민; 이태인; 조병진, 제25회 한국반도체학술대회, 서강대학교, 2018-02-07

43166
Low resistance and Low temperature Bonding between Silver and Indium

유진; Cho, SI; Kim, YH, 2nd Int. Meeting on Information Display, pp.275 - 278, 2002

43167
Low Resistive Multi-Ag-Layer for Transparent and Flexible Electrode

Choi, Kyung Cheol; Lee, S.-M.; Choi, C.S., International Workshop on Flexible & Printable Electronics2011, IWFPE 2011, International Workshop on Flexible & Printable Electronics2011, IWFPE 2011, 2011-11-17

43168
Low Resolution Pressure Image Analysis for Footprint-based Person Recognition

Bien, Zeung nam, SICE - ICASE, 2006

43169
Low RH operation of hydrocarbon polymer based catalyst layer for polymer electrolyte membrane fuel cell

Lee, Donghyun; Yuk, Seongmin; Choi, Sungyu; Doo, Gisu; Lee, Dongwook; Kim, Hee-Tak, 한국전기화학회 2017 춘계 총회 및 학술발표회, 한국전기화학회, 2017-04-06

43170
Low Sensitive Auto-encoders (only abstract)

이수영; 노지현; 이화란, 2014 뇌와 인공지능 심포지엄, 한국뇌공학회, 2014-02-20

43171
Low series resistance front surface emitting laser diode

Yoo, Hoi-Jun; Kwon, Young Se; Hayes, J.R.; Paek, E.G.; Harbinson, J.P.; Florez, L.T., Annual IEEE Device Research Conference(DRC), 1990

43172
Low Sidelobe X Band Patch Antenna Array Design with High Isolation

HARIYADI, TOMMI; 박성욱; MINZ, LAXMIKANT, 2022년 한국전자파학회 제34차 정기총회 및 추계학술대회, (사)한국전자파학회, 2022-11-18

43173
Low Temperature and Ion-Cut Based Monolithic 3D Process Integration Platform Incorporated with CMOS, RRAM and Photo-Sensor Circuits

Han, Hoonhee; Cho, Byung-Jin; Choi, Rino; Jung, Seong-Ook; S. C. Song; Choi, Changhwan; Chung, SungWoo, 66th IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM), IEEE, 2020-12-15

43174
Low temperature and ultra fine pitch joints using non-conductive adhesive for flip chip technology

Kim, SY; Oh, TS; Lee, Won-Jong; Kim, YH, 2006 7th International Conference on Electronics Packaging Technology, ICEPT '06, 2006-08-26

43175
Low temperature annealed solution-processed oxide thin film transistor

Bae, Byeong-Soo; S. Seo; Y. Hwang; J.Jeon, The International Chemical Congress of Pacific Basin Societies, PACIFICHEM 2010, 2010-12

43176
Low Temperature Annealing of Lead Chalcogenide Quantum Dot Thin Films and Its Controllability of Inter-dot Coupling

Lim, Koeng Su, 2010 MRS Fall Meeting, pp.170 -, 2010 MRS Fall Meeting, 2010

43177
Low temperature burnable CNT paste component for CNT-Field Emitter backlight unit

Lee, S; Jeon, Duk Young, Technical Digest of the 17th International Vacuum Nanoelectronics Conference, IVNC 2004, pp.124 - 125, 2004-07-11

43178
Low Temperature Camera Module Assembly Using Acrylic-based Solder ACFs with Ultrasonic-Assisted Thermo-Compression Bonding Method

Kim, Yoo-Sun; Kim, Seung-Ho; Paik, Kyung-Wook, The 63rd Electronic Components and Technology Conference, pp.1613 - 1616, The 63rd Electronic Components and Technology Conference, 2013-05-29

43179
Low Temperature Curable Anisotropic Conductive Films (ACFs) with Photo-active Curing Agent (PA-ACFs)

Kim, Il; Paik, Kyung-Wook, The 62nd Electronic Components and Technology Conference, IEEE, 2012-05

43180
Low temperature curable Sol-Gel based epoxy siloxane hybrid materials for led encapsulant

Bae, Byeong-Soo; Kim, Hwea-yoon; Bae, Jun Young; Kim, YongHo, 2013 International Sol-Gel Conference, ISGS, 2013-08

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