Via-hole filling을 위한 텅스텐 저압화학증착에 관한 연구A study on the low pressure chemical vapor deposition of tungsten for via-hole filling
- Advisors
- 천성순researcher; Chun, Soung-Soonresearcher
- Description
- 한국과학기술원 : 재료공학과,
- Publisher
- 한국과학기술원
- Issue Date
- 1990
- Identifier
- 68028/325007 / 000891089
- Language
- kor
- Description
학위논문(석사) - 한국과학기술원 : 재료공학과, 1990, [ [iii], 67 p. ]
- Appears in Collection
- MS-Theses_Master(석사논문)
- Files in This Item
- There are no files associated with this item.
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