테스트 패턴을 이용한 다결정 실리콘 박막의 열팽창 계수 측정에 관한 연구Measurement of thermal expansion coefficient of polycrystalline silicon thin film by micro test patterns
- Advisors
- 강상원researcher; Kang, Sang-Wonresearcher
- Description
- 한국과학기술원 : 재료공학과,
- Publisher
- 한국과학기술원
- Issue Date
- 1997
- Identifier
- 113157/325007 / 000953601
- Language
- kor
- Description
학위논문(석사) - 한국과학기술원 : 재료공학과, 1997.2, [ xi, 73 p. ]
- Keywords
다결정 실리콘; 테스트 패턴; 박막; 열팽창 계수; Thermal expansion coefficient; Polycrystalline silicon; MEMS; Test pattern; Thin film
- Appears in Collection
- MS-Theses_Master(석사논문)
- Files in This Item
- There are no files associated with this item.
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