학위논문(박사) - 한국과학기술원 : 재료공학과, 2002.8, [ xii, [185] p. ]
Electroplating; Intermetallic Compound; UBM (Under Bump Metallization); Flip Chip; Electromigration; 솔더; 전해도금; 금속간화합물; UBM (Under Bump Metallization); 플립칩
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