학위논문(박사) - 한국과학기술원 : 신소재공학과, 2009. 8., [ viii, 99 p. ]
Copper; Iodine; TSV (through-Si via); plasma treatment; CVD (chemical vapor deposition); 구리; 요오드; 관통비아; 플라즈마 처리; 화학기상증착법
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