랜덤진동상황에서의 표면실장부품 소더범프에 대한 피로수명평가Fatigue life assessment of bump type solder joint under random vibration environment

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dc.contributor.advisor이순복-
dc.contributor.advisor엄윤용-
dc.contributor.advisorLee, Soon-Bok-
dc.contributor.advisorEarmme, Youn-Young-
dc.contributor.author김태헌-
dc.contributor.authorKim, Tae-Heon-
dc.date.accessioned2011-12-14T06:32:46Z-
dc.date.available2011-12-14T06:32:46Z-
dc.date.issued1998-
dc.identifier.urihttp://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=133410&flag=dissertation-
dc.identifier.urihttp://hdl.handle.net/10203/44965-
dc.description학위논문(석사) - 한국과학기술원 : 기계공학과, 1998.2, [ vi, 66 p. ]-
dc.languagekor-
dc.publisher한국과학기술원-
dc.subject소더 범프-
dc.subject랜덤 진동-
dc.subjectFatigue life-
dc.subjectSolder bump-
dc.subject피로 수명-
dc.subjectRandom vibration-
dc.title랜덤진동상황에서의 표면실장부품 소더범프에 대한 피로수명평가-
dc.title.alternativeFatigue life assessment of bump type solder joint under random vibration environment-
dc.typeThesis(Master)-
dc.identifier.CNRN133410/325007-
dc.description.department한국과학기술원 : 기계공학과, -
dc.identifier.uid000963180-
dc.contributor.localauthor이순복-
dc.contributor.localauthor엄윤용-
dc.contributor.localauthorLee, Soon-Bok-
dc.contributor.localauthorEarmme, Youn-Young-
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