랜덤진동상황에서의 표면실장부품 소더범프에 대한 피로수명평가 = Fatigue life assessment of bump type solder joint under random vibration environment

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Advisors
이순복researcher엄윤용researcherLee, Soon-BokresearcherEarmme, Youn-Youngresearcher
Description
한국과학기술원 : 기계공학과,
Publisher
한국과학기술원
Issue Date
1998
Identifier
133410/325007 / 000963180
Language
kor
Description

학위논문(석사) - 한국과학기술원 : 기계공학과, 1998.2, [ vi, 66 p. ]

Keywords

소더 범프; 랜덤 진동; Fatigue life; Solder bump; 피로 수명; Random vibration

URI
http://hdl.handle.net/10203/44965
Link
http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=133410&flag=dissertation
Appears in Collection
ME-Theses_Master(석사논문)
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