High frequency modeling of multiple line grid array (MLGA) package and embedded passives = Multiple line grid array (MLGA) 패키지의 고주파 모델과 내부 삽입 수동 소자 연구

Cited 0 time in webofscience Cited 0 time in scopus
  • Hit : 297
  • Download : 0
In this paper, we introduce the MLGA package and its electrical equivalent circuit model, and the equivalent circuit model parameters are extracted by measurement. Further more, this paper discusses the design and the estimation of the embedded passives, such as multi-layer parallel plate capacitor and a spiral inductor in the MLG. According to the simulation result using Finite Element Method (FEM), the capacitance value of the embedded capacitor ranges from 7pF to 170pF when glass ceramic, which has 7.8 of dielectric constant, is used. And three types of inductors are suggested as possible embedded inductor structures and compared with their electrical characteristics. The effects of the decoupling capacitor using the embedded passives in the MLG is simulated and demonstrated to be quite useful suppressing the simultaneous switching noise and noise filtering.
Advisors
Kim, Joung-Horesearcher김정호researcher
Description
한국과학기술원 : 전기및전자공학전공,
Publisher
한국과학기술원
Issue Date
2001
Identifier
165969/325007 / 000983456
Language
eng
Description

학위논문(석사) - 한국과학기술원 : 전기및전자공학전공, 2001.2, [ 103 p. ]

Keywords

modeling; package; passive; 수동 소자; 모델링; 패키지

URI
http://hdl.handle.net/10203/37463
Link
http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=165969&flag=dissertation
Appears in Collection
EE-Theses_Master(석사논문)
Files in This Item
There are no files associated with this item.

qr_code

  • mendeley

    citeulike


rss_1.0 rss_2.0 atom_1.0