기판접착을 이용한 몸체접지형SOI nMOSFET에 대한 연구Study on grounded body SOI n-channel MOSFET by wafer bonding
- Advisors
- 이귀로researcher; Lee, Kwy-Roresearcher
- Description
- 한국과학기술원 : 전기 및 전자공학과,
- Publisher
- 한국과학기술원
- Issue Date
- 1996
- Identifier
- 106106/325007 / 000855009
- Language
- kor
- Description
학위논문(박사) - 한국과학기술원 : 전기 및 전자공학과, 1996.2, [ viii, 93 p. ]
- Keywords
모스소자; 기팝접착; 에스오아이; 몸체접지; Grounded Body; MOSFET; Wafer Bonding; SOI
- Appears in Collection
- EE-Theses_Ph.D.(박사논문)
- Files in This Item
- There are no files associated with this item.
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