Novel electromagnetic bandgap structures for broadband noise isolation in multi-layer package and printed circuit board = 다층 패키지 및 PCB에서의 광대역 잡음 억제를 위한 새로운 EBG 구조들

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This dissertation proposes a novel electromagnetic bandgap (EBG) structure with a significantly extended noise isolation bandwidth, called a double-stacked EBG (DS-EBG) structure, fabricated on a low-temperature co-fired ceramic (LTCC) multilayer substrate. The DS-EBG structure was devised for wideband suppression of simultaneous switching noise (SSN) coupling in multi-layer System-in-Package (SiP) and Printed Circuit Board applications. The proposed DS-EBG structure was analyzed by using an analytical modeling method for mushroom-type EBG. Design approach was enabled by combining two EBG layers embedded between the power and ground planes. The two EBG layers had different band gaps from using different cell sizes. Enhanced wideband suppression of the SSN coupling was validated using a 11.4 GHz noise stop bandwidth with 30 dB isolation in time and frequency domain measurements up to 20 GHz. Furthermore, double-stacked EBG structure, which embeds high dielectric constant film material, was investigated to make broader stopband, and was successfully verified through time and frequency domain measurement up to 20 GHz. The DS-EBG structure embedding high dielectric constant film material provides about 17 GHz stopband with 30 dB isolation. LTCC-based X/Ku-band transceiver SiP with DS-EBG was fabricated for validating the effect of the proposed EBG structure. The fabricated transceiver SiP is composed of Ku-band transmitter and X/Ku-band receiver. The effect of DS-EBG, which gives a 30 dB isolation over X/Ku-band ranges, was demonstrated through frequency and time (Output signal, Noise figure) domain measurement. Finally, to suppress noises generated in multi-layer packages or PCBs, the proposed DS-EBG structure ring was applied and verified through 2.5D simulation. DS-EBG ring structure was applied and successfully verified to suppress the power/ground noise coupling through the plane cutout and the return current discontinuity in single-ended as well as differenti...
Joung-ho Kimresearcher김정호researcher
한국과학기술원 : 전기및전자공학전공,
Issue Date
295421/325007  / 020045106

학위논문(박사) - 한국과학기술원 : 전기및전자공학전공, 2008, [ x, 141 p. ]


EBG; DS-EBG; SSN; Coupling; Isolation; EBG; DS-EBG; 파워 노이즈; 커플링; 차단; EBG; DS-EBG; SSN; Coupling; Isolation; EBG; DS-EBG; 파워 노이즈; 커플링; 차단

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