Quinone curable compositions and adhesive compositions comprising same퀴논 경화형 조성물 및 이를 포함하는 접착제 조성물

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dc.contributor.authorHwang, Hong Guko
dc.contributor.authorHahn, Jung Seokko
dc.contributor.authorLee, Haeshinko
dc.contributor.authorWang, Younseonko
dc.date.accessioned2021-07-08T00:10:20Z-
dc.date.available2021-07-08T00:10:20Z-
dc.identifier.urihttp://hdl.handle.net/10203/286504-
dc.description.abstractThe present invention relates to a curable composition and a use thereof and, more particularly, to a curable composition and a use thereof, the curable composition comprising: (a) a compound capable of being denatured to a quinone-based compound by oxygen; (b) an amine-based polymeric compound; and (c) an oxygen clathrate structure. The curable composition is rapidly cured and can be cured not only at an interface of a conventional film but also to the inside of the film, such that the curable composition has uniform physical properties throughout the entire film and excellent physical properties compared to a curing film obtained by curing at an existing interface.-
dc.titleQuinone curable compositions and adhesive compositions comprising same-
dc.title.alternative퀴논 경화형 조성물 및 이를 포함하는 접착제 조성물-
dc.typePatent-
dc.type.rimsPAT-
dc.contributor.localauthorLee, Haeshin-
dc.contributor.nonIdAuthorHwang, Hong Gu-
dc.contributor.nonIdAuthorHahn, Jung Seok-
dc.contributor.nonIdAuthorWang, Younseon-
dc.contributor.assigneeKAIST, KOLON INDUSTRIES INC-
dc.identifier.iprsType특허-
dc.identifier.patentApplicationNumber16337179-
dc.identifier.patentRegistrationNumber11001683-
dc.date.application2017-09-27-
dc.date.registration2021-05-11-
dc.publisher.countryUS-
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CH-Patent(특허)
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