Piezoelectric Ceramics and Flexible Printed Circuits' Interconnection Using Sn58Bi Solder Anisotropic Conductive Films for Flexible Ultrasound Transducer Assembly

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Interconnection technology using Sn58Bi solder anisotropic conductive films (ACFs) has been chosen to assemble piezoelectric ceramics on flexible printed circuits for ultrasound imaging applications. The bonding and dicing processes were performed, and the bending of test samples was evaluated. The results showed excellent integrity of solder ACFs' interconnects compared with other Ni-/Au-coated polymer ball and Ni ball-based ACFs' interconnects. The metallurgical interconnects of the solder ACFs produce lower electrical resistances after pressure cooker and bending reliability tests. Moreover, the solder ACFs with a high-speed bonding process resulted in more electrically conductive, more reliable, and finer-pitch bonding for producing higher process yield and higher density ultrasound transducer arrays.
Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Issue Date
2019-09
Language
English
Article Type
Article
Citation

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.9, no.9, pp.1897 - 1903

ISSN
2156-3950
DOI
10.1109/TCPMT.2019.2907927
URI
http://hdl.handle.net/10203/271106
Appears in Collection
MS-Journal Papers(저널논문)
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