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College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Conference Papers(학술회의논문)

Wapage Analysis of Flexible Electronics

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Kim, Taek-Sooresearcher
Publisher
The Japan Institute of Electronics Packaging
Issue Date
2019-04-19
Language
English
Citation

International Conference on Electronics Packaging

URI
http://hdl.handle.net/10203/271088
Appears in Collection
ME-Conference Papers(학술회의논문)
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