두꺼운 복합재 평판의 기공에 의한 기계적 물성 저하와 비파괴적 평가Degradation of mechanical properties due to void in thick composite laminates and its nondestructive evaluation
- Advisors
- 김천곤researcher; Kim, Chun-Gonresearcher
- Description
- 한국과학기술원 : 항공우주공학전공,
- Publisher
- 한국과학기술원
- Issue Date
- 2002
- Identifier
- 174203/325007 / 020003037
- Language
- kor
- Description
학위논문(석사) - 한국과학기술원 : 항공우주공학전공, 2002.2, [ v, 51 p. ]
- Keywords
기계적 성질; 비파괴 검사; 기공; 후판복합재; S2-글라스/폴리에스터; S2-glass/polyester; Mechanical Properties; Nondestructive Evaluation; Void; Thick Composites
- Appears in Collection
- AE-Theses_Master(석사논문)
- Files in This Item
- There are no files associated with this item.
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