An On-Chip Thermal Monitoring System With a Temperature Sensing Area of 52 mu m(2) in 180-nm CMOS

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In this brief, an on-chip remote thermal monitoring system with a temperature sensing area of 52 mu m(2) is proposed. To minimize the area, a diode-connected pMOS is exploited as the linear temperature sensing element and a read-out unit is shared among the sensors. The effect of parasitic resistance along the interconnect is reduced by the proposed voltage-to-time converter (VTC). For temperature independent read-out, two feedback loops are employed that exploit the stable period of a crystal oscillator. Implemented in 180-nm CMOS, the prototype IC achieves +2.3 degrees C/-2.2 degrees C error over 0 to 100 degrees C after one-point calibration at 25 degrees C.
Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Issue Date
2019-10
Language
English
Article Type
Article; Proceedings Paper
Citation

IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-EXPRESS BRIEFS, v.66, no.10, pp.1638 - 1642

ISSN
1549-7747
DOI
10.1109/TCSII.2019.2925132
URI
http://hdl.handle.net/10203/268106
Appears in Collection
EE-Journal Papers(저널논문)
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