Plasma producing apparatus and substrate board treatment플라즈마 발생 장치 및 기판 처리 장치

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dc.contributor.author장홍영ko
dc.contributor.author이윤성ko
dc.contributor.author서상훈ko
dc.date.accessioned2019-08-13T06:20:06Z-
dc.date.available2019-08-13T06:20:06Z-
dc.date.issued2019-05-21-
dc.identifier.urihttp://hdl.handle.net/10203/264143-
dc.description.abstractDisclose a kind of plasma producing apparatus i.e. substrate board treatment.The plasma producing apparatus includes: the multiple grounding electrodes for being arranged in inside vacuum tank and extending parallel to one another;And the power electrode being arranged between grounding electrode.There are the region of constant distance between grounding electrode and power electrode, power electrode is tapered on the direction in face of substrate.Power electrode is connected to RF power source, and on the direction in face of substrate, and the height of power electrode is greater than the height of grounding electrode.-
dc.titlePlasma producing apparatus and substrate board treatment-
dc.title.alternative플라즈마 발생 장치 및 기판 처리 장치-
dc.typePatent-
dc.type.rimsPAT-
dc.contributor.localauthor장홍영-
dc.contributor.nonIdAuthor이윤성-
dc.contributor.assigneeKAIST-
dc.identifier.iprsType특허-
dc.identifier.patentApplicationNumber201610318718.4-
dc.identifier.patentRegistrationNumber106024568-
dc.date.application2012-03-29-
dc.date.registration2019-05-21-
dc.publisher.countryCC-
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PH-Patent(특허)
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