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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Low Temperature Fine Pitch Flex-on-Flex (FOF) Assembly using Nanofiber Sn58Bi Solder Anisotropic Conductive Films (ACFs) and Ultrasonic Bonding Method

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Kim, Tae Wan / Suk, Kyung-Lim / Paik, Kyung-Wookresearcher
Publisher
The 63rd Electronic Components and Technology Conference
Issue Date
2013-05-29
Language
English
Citation

The 63rd Electronic Components and Technology Conference, pp.461 - 467

DOI
10.1109/ECTC.2013.6575612
URI
http://hdl.handle.net/10203/258339
Appears in Collection
MS-Conference Papers(학술회의논문)
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