Effect of Material Properties of Double-Layer Non Conductive Films (D-NCFs) On the Reflow Reliability of Ultra Fine-pitch Cu-pillar/Sn-Ag Micro Bump Interconnection

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In order to interconnect ultrafine pitch Cupillar/Sn-Ag micro bump, Non Conductive Films (NCFs) have been used. During thermo-compression bonding processes, applied pressure and heat make molten solder deform and wet on the sidewall of Cu-pillar. As a result, large Sn-Ag/Cu-pillar sidewall interface reaction makes Sn consumption faster and the Kirkendall void formation. In this study, novel double-layer NCFs(D-NCFs) have been introduced and successfully solve the solder sidewall wetting problem of Cu-pillar. As a result, D-NCFs with proper curing behavior of NCFs material properties prevent Sn wetting on the Cu sidewall and increased the remaining Sn content at the solder joint. Therefore, NCFs with better mechanical properties produced good joint interconnection properties after solder reflow test resulting in better reliability electrical performance.
Publisher
IEEE-CPMT
Issue Date
2017-06-01
Language
English
Citation

IEEE 67th Electronic Components and Technology Conference (ECTC), pp.2110 - 2115

ISSN
0569-5503
DOI
10.1109/ECTC.2017.62
URI
http://hdl.handle.net/10203/223718
Appears in Collection
MS-Conference Papers(학술회의논문)
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