학위논문(박사) - 한국과학기술원 : 전기및전자공학부, 2016.2 ,[vii, 50 p. :]
: printed circuit board (PCB); package; high efficiency; wireless power transfer; magnetic field resonance coupling; voltage transfer ratio; power transfer efficiency; CMOS full bridge rectifier; 피씨비; 패키지; 무선 전력 전송; 자기장 공진; 전압 전달비; 전력 전달 효율; 정류기
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