Packaging Completed Ultrathin Si-based Flexible NAND-Type Flash Memory
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 김도현 | ko |
| dc.contributor.author | 이건재 | ko |
| dc.date.accessioned | 2017-01-18T04:45:45Z | - |
| dc.date.available | 2017-01-18T04:45:45Z | - |
| dc.date.created | 2017-01-08 | - |
| dc.date.issued | 2015-02-11 | - |
| dc.identifier.citation | 제 22회 한국반도체 학술대회 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/219889 | - |
| dc.language | English | - |
| dc.publisher | 삼성전자, 한국반도체산업협회,한국반도체연구조합 | - |
| dc.title | Packaging Completed Ultrathin Si-based Flexible NAND-Type Flash Memory | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | 제 22회 한국반도체 학술대회 | - |
| dc.identifier.conferencecountry | KO | - |
| dc.identifier.conferencelocation | 송도컨벤시아, 인천 | - |
| dc.contributor.localauthor | 이건재 | - |
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