플렉시블 전자기기 응용을 위한 미세 솔더 범프 접합부에 관한 연구Study on Joint of Micro Solder Bump for Application of Flexible Electronics
- Publisher
- 대한용접접합학회
- Issue Date
- 2013-06
- Language
- Korean
- Citation
대한용접접합학회지, v.31, no.3, pp.4 - 10
- ISSN
- 1225-6153
- Appears in Collection
- ME-Journal Papers(저널논문)
- Files in This Item
- There are no files associated with this item.
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