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College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Conference Papers(학술회의논문)

Warpage analysis of electroplated Cu and solder resist films on polymer based packaging substrate

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Kim, CG / Lee, T / Kim, MS / Kim, Taek-Sooresearcher
Publisher
International Conference on Experimental Mechanics
Issue Date
2014-11-14
Language
English
Citation

International Conference on Experimental Mechanics 2014

URI
http://hdl.handle.net/10203/193223
Appears in Collection
ME-Conference Papers(학술회의논문)
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