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College of Engineering(공과대학)Dept. of Nuclear and Quantum Engineering(원자력및양자공학과)NE-Conference Papers(학술회의논문)

On-chip PDN design effects on 3D stacked on-chip PDN impedance based on TSV interconnection

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Pak, J.S. / Kim, J. / Cho, J. / Lee, J. / Lee, H. / Park, K.
Publisher
IEEE EDAPS 2010
Issue Date
2010-12-07
Language
ENG
Citation

2010 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2010

URI
http://hdl.handle.net/10203/164159
Appears in Collection
NE-Conference Papers(학술회의논문)
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