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College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Conference Papers(학술회의논문)

Inspection of ball grid array (BGA) solder joints using X-ray cross-sectional images

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dc.contributor.authorRoh Y.J.-
dc.contributor.authorKo K.W.-
dc.contributor.authorCho, Hyungsuck-
dc.contributor.authorKim H.C.-
dc.contributor.authorJoo H.N.-
dc.contributor.authorKim S.K.-
dc.date.accessioned2007-10-02T08:11:40Z-
dc.date.available2007-10-02T08:11:40Z-
dc.date.created2012-02-06-
dc.date.issued1999-09-21-
dc.identifier.citationProceedings of the 1999 Machine Vision Systems for Inspection and Metrology VIII, v.3836, no., pp.168 - 178-
dc.identifier.issn0277-786X-
dc.identifier.urihttp://hdl.handle.net/10203/1607-
dc.descriptionCopyright 1999 Society of Photo-Optical Instrumentation Engineers.en
dc.languageENG-
dc.language.isoen_USen
dc.publisherInternational Society for Optical Engineering (SPIE)-
dc.titleInspection of ball grid array (BGA) solder joints using X-ray cross-sectional images-
dc.typeConference-
dc.identifier.scopusid2-s2.0-0033334669-
dc.type.rimsCONF-
dc.citation.volume3836-
dc.citation.beginningpage168-
dc.citation.endingpage178-
dc.citation.publicationnameProceedings of the 1999 Machine Vision Systems for Inspection and Metrology VIII-
dc.identifier.conferencecountryUnited States-
dc.identifier.conferencecountryUnited States-
dc.contributor.localauthorCho, Hyungsuck-
dc.contributor.nonIdAuthorRoh Y.J.-
dc.contributor.nonIdAuthorKo K.W.-
dc.contributor.nonIdAuthorKim H.C.-
dc.contributor.nonIdAuthorJoo H.N.-
dc.contributor.nonIdAuthorKim S.K.-
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ME-Conference Papers(학술회의논문)
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