Wafer level packages (WLPs) using anisotropic conductive adhesives (ACAs) solution for flip-chip interconnections

Cited 0 time in webofscience Cited 0 time in scopus
  • Hit : 580
  • Download : 0
Issue Date
2008-05-27
Language
ENG
Citation

2008 58th Electronic Components and Technology Conference, ECTC, pp.219 - 224

ISSN
0569-5503
URI
http://hdl.handle.net/10203/155146
Appears in Collection
MS-Conference Papers(학술회의논문)
Files in This Item
There are no files associated with this item.

qr_code

  • mendeley

    citeulike


rss_1.0 rss_2.0 atom_1.0