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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Effect of Sb addition in Sn-Ag-Cu solder balls on the drop test reliability of BGA packages with Electroless Nickel Immersion Gold (ENIG) surface finish

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Park, YS / Kwon, YM / Son, HY / Moon, JT / Jeong, BW / Kang, KI / Paik, Kyung-Wookresearcher
Publisher
123
Issue Date
2007-11-19
Language
English
Citation

The 9th International Conference on Electronic Materials and Packaging, EMAP 2007, pp.0

URI
http://hdl.handle.net/10203/154438
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MS-Conference Papers(학술회의논문)
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